CHINESE JOURNAL OF ENERGETIC MATERIALS
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Curing Reaction Kinetics of HTPB/TDI Bonding System
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(1. State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology,Beijing 100081, China; 2. Beijing Auxin Chemical Technology Ltd, Beijing 100040, China)

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    Abstract:

    To solve the problem on end point of curing encountered in engineering application, the curing reaction kinetics of hydroxyl-terminated polybutadiene(HTPB) type bonding system used for polymer bonded explosive(PBX) wss studied by isothermal and non-isothermal differential scanning calorimetry(DSC) through the simulation of n-order reaction kinetic model according to Kissinger method and Crane method. Results show that the apparent activation energy, reaction order, pre-exponential factor and curing reaction heat for curing reaction of HTPB/TDI bonding system are 54.61 kJ·mol-1, 0.87, 192.80 s-1 and 482.87 J·g-1, respectively. Autocatalytic phenomenon exists in the curing reaction process of the system. After adding the dibutytin dilaureate (T12) catalyst, the curing reaction rate of the bonding system increases and the reaction temperature decreases. The function relation between the curing temperature and the curing time is fitted and obtained. Calculated curing time is about 3.91 days when the curing temperature is 60 ℃, which is consistent with 4-6 days in the practical engineering applications.

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吴兴宇,崔庆忠,徐军. HTPB/TDI粘结体系的固化反应动力学[J].含能材料,2016,24(11):1097-1101.
WU Xing-yu, CUI Qing-zhong, XU Jun. Curing Reaction Kinetics of HTPB/TDI Bonding System[J]. Chinese Journal of Energetic Materials,2016,24(11):1097-1101.

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History
  • Received:April 20,2016
  • Revised:June 12,2016
  • Adopted:July 01,2016
  • Online: November 15,2016
  • Published: November 21,2016