To understand the reasons for the formation of 3, 4-dinitrofurazanfuroxan(DNTF) charge defects, the solidification behavior of DNTF and TNT was contrasted and analyzed.The volume shrinkage of DNTF and TNT was tested.The solidification defect distributions of DNTF and TNT were observed by industrial CT and scanning electron microscope.Thermal properties of DNTF and TNT were tested by DSC and thermal conductivity measurer.The curves of temperature vs time describing the solidifying process of DNTF and TNT were obtained by a solidification rate testing device.Results show that the volume shrinkage of DNTF and TNT is 11.6% and 12.7% respectively.The defect distribution of DNTF is more dispersive, but the defect distribution of TNT is relatively.concentrative.The solidifying point, solidification heat, specific heat capacity and thermal conductivity are 110.2 ℃, 100.2 J·g^-1, 0.943 J·g^-1· ℃^-1 and 0.197 W·m^-1· ℃^-1 for DNTF and 80.9 ℃; 104.6 J·g^-1; 1.278 J·g^-1· ℃^-1and 0.224 W·m^-1· ℃ for TNT, respectively. The solidification rate of DNTF is higher than that of TNT.With increasing the solidified layer thickness, the interval time of solidification generated between each layer from the lower layer to the upper layer occurs rapidly shortening trend.The solidification process of DNTF has characteristics of volumetric solidification, whereas the solidification process of TNT has characteristics of layer by layer solidification.