To acquire the failure mode and failure mechanism of semiconductor bridge (SCB) initiator in the process of long-term storage, the changes in resistance and appearance of SCB electrode plugs before and after storage in various environment stress were studied by accelerated life test, resistance test and scan electron microscope test. Results show that a single temperature (71 ℃) stress does not cause the corrosion of SCB electrode plugs and accretion of resistance. Temperature and humidity (80 ℃, RH=95%) stress can cause slow corrosion of leading wire of SCB electrode plugs and resistance adding slightly. Under the temperature and humidity(80 ℃, RH=95%) stress, SCB electrode plugs with salt water after storage appear serious corrosion phenomenon. A conclusion of accelerating the corrosion of SCB electrode plugs by chlorine ion and corrosion degree of judging the soldering joints by resistance size of SCB electrode plugs is obtained. Namely the greater the resistance of SCB electrode plug, the deeper the corrosion degree of bridge or soldering joints