CHINESE JOURNAL OF ENERGETIC MATERIALS
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多孔硅含能芯片的制备工艺和性能研究
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王守旭(1982-),男,博士研究生,主要从事纳米含能材料的微结构、点火和爆炸性能的研究。email: hongliushu03@gmail.com

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Preparation and Properties of Porous Silicon Energetic Chips
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    摘要:

    采用电化学双槽腐蚀法在P型单晶硅片表面生长多孔硅膜。利用超声强化原位装药技术,在多孔硅膜中填充高氯酸铵或高氯酸钠制备多孔硅含能芯片。试验表明: 采用电化学双槽腐蚀法可以制备厚度达90~100 μm的不龟裂多孔硅厚膜; 该多孔硅膜能够承受超声填充高氯酸铵和高氯酸钠等氧化剂时的冲击,得到多孔硅含能芯片。该多孔硅含能芯片在450~470 ℃的热作用下,可在开放空间发生猛烈爆炸。高氯酸铵比高氯酸钠更适合制备多孔硅含能芯片。

    Abstract:

    The porous silicon was prepared by electrochemical etching and it was filled ammonium perchlorate or sodium perchlorate with in-situ method in order to get porous silicon energetic chips. Results show that the thickness of porous silicon layer is 90-100 μm,and these porous silicon layers endure the ultrasonic waves when porous silicon layers are filled ammonium perchlorate or sodium perchlorate into them. These porous silicon energetic chips could explode strongly at 450-470 ℃ in open air. Ammonium perchlorate is better than sodium perchlorate on the preparation of porous silicon energetic chips.

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王守旭,沈瑞琪,叶迎华.多孔硅含能芯片的制备工艺和性能研究[J].含能材料, 2010, 18(5):527-531. DOI:10.3969/j. issn.1006-9941.2010.05.011.
WANG Shou-xu, SHEN Rui-qi, YE Ying-hua. Preparation and Properties of Porous Silicon Energetic Chips[J]. Chinese Journal of Energetic Materials, 2010, 18(5):527-531. DOI:10.3969/j. issn.1006-9941.2010.05.011.

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  • 收稿日期: 2010-01-15
  • 最后修改日期: 2010-04-14
  • 录用日期: 2010-04-29
  • 在线发布日期: 2012-02-22
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